• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to a method for crystallizing an amorphous film using an electric field and ultraviolet light, and to a method for manufacturing a liquid crystal display device using the same. In particular, the method for crystallizing an amorphous film includes forming an amorphous film on which a catalyst metal is deposited on a substrate, and the amorphous film. And irradiating ultraviolet rays to the light, and applying an electric field to the amorphous film.
    公开号:KR20030005909A
    申请号:KR1020010041377
    申请日:2001-07-10
    公开日:2003-01-23
    发明作者:진 장；김경호
    申请人:엘지.필립스 엘시디 주식회사；학교법인 경희대학교；
    IPC主号:
    专利说明:

    Amorphous film crystallization method and manufacturing method of liquid crystal display device using the same {Crystallizatiion Method And Method For Fabricating Liquid Crystal Display Device By Using Said Method}
    [17] The present invention relates to an amorphous film crystallization method, and more particularly, to an amorphous film crystallization method using an electric field and ultraviolet light and a method of manufacturing a liquid crystal display device using the same.
    [18] As devices become larger and more integrated, switching devices become thinner, and accordingly, conventional amorphous silicon thin film transistors are being replaced by polysilicon thin film transistors.
    [19] Although the process temperature of amorphous silicon thin film transistor is 350 ℃ or less, it can be easily made on glass substrate, but it is difficult to use in high speed operation circuit because of low mobility.
    [20] However, since polysilicon has a higher mobility than amorphous silicon, a driving circuit can be made on a substrate. Thus, polycrystalline silicon is advantageous as a switching element of high resolution, large area devices.
    [21] There are two methods for forming polycrystalline silicon: direct deposition of polycrystalline silicon and crystallization of polysilicon after deposition of amorphous silicon. The latter method includes solid phase crystallization (SPC method) and excimer laser annealing. ELA method (Eximer Lazer Annealing), metal induced crystallization method (MIC method).
    [22] Here, the SPC method is a relatively simple crystallization method for producing a polycrystalline silicon film by heat treatment for a long time in a furnace (furnace) of 600 ℃ or higher, but high crystallization temperature and long heat treatment time is essential. In addition, there are many defects inside the crystallized crystal grains, which makes it difficult to fabricate the device, and there is a disadvantage that the glass substrate cannot be used due to the high crystallization temperature.
    [23] The ELA method is a method of crystallizing a thin film by instantaneously irradiating an excimer laser having a short wavelength of strong energy, which enables low temperature crystallization of 400 ° C. or less, and enables the production of crystal grains having large crystal grains and excellent characteristics. However, it is difficult to manufacture mass-produced devices and large-area devices because crystallization proceeds unevenly and requires expensive auxiliary equipment.
    [24] Metal-induced crystallization is a method introduced through research to lower the crystallization temperature, and can be crystallized at a temperature of 500 ° C. or lower, and is advantageous for manufacturing a large area liquid crystal display device.
    [25] The metal-induced crystallization is an advanced form of the FE-MIC (Feild Enhanced-MetalInduced Crystallization) method. The FE-MIC method is a low-temperature crystallization process using a catalytic metal, and when a metal impurity is added to an amorphous silicon film, The focus is on the fact that the crystallization temperature of the thin film is significantly lowered because the binding energy of silicon becomes smaller due to the action of free electrons.
    [26] The FE-MIC method is advantageous in large area glass substrate application because when the electric field is applied to the amorphous silicon film containing the catalyst metal, the crystallization time is shortened and the crystallization temperature is lowered compared to the conventional metal induction crystallization method. In general, the FE-MIC method is affected by the amount of the catalyst metal, and the crystallization temperature tends to decrease as the amount of the catalyst metal increases.
    [27] Hereinafter, with reference to the accompanying drawings will be described a crystallization method of the amorphous film of the prior art and a manufacturing method of the liquid crystal display device applying the same as follows.
    [28] First, referring to the method of crystallizing an amorphous film, as shown in FIG. 1A, a buffer layer 2 is formed on a substrate 1, and plasma-enhanced CVD (PECVD) and low-pressure CVD using silane gas are formed thereon. Amorphous silicon is deposited at 300-400 ° C. using a method such as Sputter, or the like, to form an amorphous silicon thin film 3.
    [29] The buffer layer 2 prevents impurities of the substrate 1 from diffusing into the amorphous silicon thin film 3 and blocks heat flow into the substrate 1 in a future crystallization process.
    [30] Next, as shown in FIG. 1B, a catalyst metal layer 4 is formed by depositing a metal such as nickel (Ni) on the amorphous silicon thin film 3 using plasma, and using the high temperature lamp to form the amorphous silicon thin film. An annealing process of heat treatment of (3) is performed.
    [31] At this time, nickel atoms diffuse into the amorphous silicon thin film to form nickel silicide that promotes crystallization.
    [32] Subsequently, electrodes are provided at both ends of the amorphous silicon thin film 3 on which the catalyst metal layer 4 is formed to apply an electric field. Then, rod-shaped crystal grains in the <111> direction grow by the movement of nickel silicide.
    [33] In this case, the binding energy of the amorphous silicon thin film is reduced by the free electrons of the nickel atoms, thereby lowering the crystallization temperature, and the crystallization time can be reduced because the nickel atoms act as seeds for crystallization.
    [34] This crystallizes into polycrystalline silicon having amorphous silicon thin film 3 crystal grains.
    [35] As described above, the use of the Feen Enhanced Metal Induced Crystallization (FE-MIC) method, which is a low-temperature crystallization method using a catalytic metal, has an advantage that the crystallization speed is low, the cost is low, and the glass substrate can be applied to a large area glass substrate.
    [36] In the method of manufacturing a liquid crystal display device using the crystallization method, first, a buffer layer made of silicon oxide is formed on a thin film array substrate, an amorphous silicon thin film is formed thereon, and then an electric field is applied while heating the amorphous silicon thin film. Is crystallized into polycrystalline silicon.
    [37] Next, an active semiconductor layer is formed by patterning the crystallized polysilicon thin film, and silicon nitride (SiNx) is deposited on the entire surface including the semiconductor layer to form a gate insulating layer.
    [38] Thereafter, a low resistance metal film is deposited on the gate insulating film and patterned by photolithography to form a gate wiring and a gate electrode, and ion source implants into the semiconductor layer using the gate patterns as a mask. To form a drain region.
    [39] Next, a data line crossing the gate line and a source / drain electrode connected to the source / drain area are formed. In this case, the data patterns are insulated from the gate patterns by an interlayer insulating film.
    [40] Subsequently, when the passivation layer is formed on the entire surface including the source / drain electrodes and the pixel electrode connected to the drain electrode is formed through the passivation layer, the array substrate of the liquid crystal display device is completed.
    [41] A color filter substrate having a color filter layer and a common electrode on the thin film array substrate is bonded to each other, and a liquid crystal layer is formed between the two substrates to form a liquid crystal display device.
    [42] However, the conventional method of crystallizing an amorphous film as described above and a method of manufacturing a liquid crystal display device employing the same have the following problems.
    [43] That is, in order to apply the crystallization method of the amorphous film to a large area glass substrate, the crystallization temperature should be low and the heat treatment should be uniform for all the substrates.
    [44] However, the conventional heat treatment method using a lamp is difficult to maintain the uniformity of the heat treatment temperature, there is a limit to apply to a large area device, the temperature rise of the glass substrate occurs with the problem of substrate deformation by applying to a large area substrate.
    [45] The present invention has been made to solve the above problems, and the crystallization method of the amorphous film to crystallize the amorphous silicon thin film into a polysilicon thin film in a short time by applying an electric field and irradiated with ultraviolet rays, and a method of manufacturing a liquid crystal display device using the same The purpose is to provide.
    [1] 1A to 1C are process cross-sectional views for explaining the amorphous film crystallization method according to the prior art.
    [2] 2A to 2D are cross-sectional views for explaining an amorphous film crystallization method according to a first embodiment of the present invention.
    [3] 3 is a cross-sectional view for explaining an amorphous film crystallization method according to a second embodiment of the present invention.
    [4] 4 is a cross-sectional view for explaining an amorphous film crystallization method according to a third embodiment of the present invention.
    [5] 5 is an optical photomicrograph of a silicon thin film before and after crystallization according to the present invention.
    [6] 6 is a graph showing the Raman spectrum of the polysilicon thin film according to the present invention.
    [7] 7A to 7F are cross-sectional views illustrating a method of manufacturing a liquid crystal display device according to the present invention.
    [8] * Explanation of symbols on the main parts of the drawings
    [9] 11,111: substrate 12, 112: silicon oxide film
    [10] 13, 113: amorphous silicon thin film 14, 114: catalytic metal
    [11] 15, 115: electrode 123: semiconductor layer
    [12] 123a, 123b: source / drain area 123b: channel area
    [13] 124: gate insulating film 125: gate electrode
    [14] 126: interlayer insulating film 127: data wiring
    [15] 127a, 127b: source / drain electrodes 128: protective film
    [16] 129 pixel electrode
    [46] Crystallization method of the amorphous film of the present invention for achieving the above object comprises the steps of forming an amorphous film on which a catalytic metal is deposited on a substrate, irradiating ultraviolet light to the amorphous film, and applying an electric field to the amorphous film Characterized in that comprises a step.
    [47] In addition, the method of manufacturing a liquid crystal display device using the crystallization method may include forming an amorphous film on which a catalyst metal is deposited on a first substrate, and crystallizing the polycrystalline film by irradiating UV light on the amorphous film and applying an electric field. And forming a semiconductor layer by patterning the polycrystalline film, forming a gate electrode insulated from the semiconductor layer at a predetermined portion of the semiconductor layer, and implanting impurities into the semiconductor layer to form a channel region and a source / drain. Forming a region, forming a source / drain electrode connected to the source / drain region, forming a pixel electrode connected to the drain electrode, and between a second substrate facing the first substrate It characterized by comprising a step of forming a liquid crystal layer.
    [48] That is, the present invention is characterized by irradiating ultraviolet rays without using a high temperature lamp in the annealing process for crystallizing the amorphous film.
    [49] The reason for irradiating ultraviolet rays is that the temperature of only the amorphous film can be increased by the difference in absorption coefficient between the amorphous film and the glass substrate.
    [50] Hereinafter, with reference to the accompanying drawings will be described in detail the crystallization method of the amorphous film according to an embodiment of the present invention and the manufacturing method of the liquid crystal display device to which the same is applied.
    [51] First embodiment
    [52] 2A to 2D are cross-sectional views illustrating a method of crystallizing an amorphous film according to a first embodiment of the present invention.
    [53] First, in the crystallization method according to the first embodiment of the present invention, as shown in FIG. 2A, a silicon film is formed on the substrate 11, and then chemically reacted with oxygen (O 2 ) or water vapor at a high temperature of 800 to 1200 ° C. A silicon oxide film (SiO 2 ) 12 is formed.
    [54] Here, the silicon oxide film 12 prevents impurities of the substrate 11 from diffusing into the amorphous silicon thin film 13 as a buffer layer, and blocks heat flow into the substrate 11 in a future crystallization process.
    [55] And, as shown in Figure 2b, by using a method such as PECVD (Plasma-Enhanced CVD), LPCVD (Low-Pressure CVD), Sputter using a silane gas on the silicon oxide film 12 at 300-400 ℃ After depositing silicon (Amorphous Silicon) to form an amorphous silicon thin film 13, the amorphous silicon thin film is crystallized to polycrystalline silicon through FE-MIC technology and UV irradiation, a low-temperature crystallization method using a catalytic metal.
    [56] Specifically, the catalyst metal 14 is disposed on the amorphous silicon thin film 13 using a plasma of a non-reactive gas.
    [57] The catalyst metal 14 uses nickel (Ni), cobalt (Co), or the like, and the amount of metal particles incident on the amorphous silicon thin film 13 film is 5 × 10 12 to 5 × 10 14 per unit area (cm 2 ). It is to be made, and uniformly disposed on the entire surface of the amorphous silicon thin film (13).
    [58] At this time, it is important to control the amount of catalytic metal. If the amount of the catalyst metal increases, the crystallization temperature is lowered, but the crystal grains do not increase in size, and leakage current may occur due to the remaining catalyst metal when the device is driven.
    [59] Next, as shown in FIG. 2C, ultraviolet rays having a wavelength of 100 to 400 nm are irradiated from the upper side of the substrate on which the catalyst metal 14 is disposed so that the temperature of the amorphous silicon thin film 13 reaches 300 to 1200 ° C. Then, the catalytic metal diffuses from the silicon thin film interface toward the silicon thin film to form a silicide phase, and the silicide promotes crystallization and lowers the crystallization temperature.
    [60] At this time, the ultraviolet ray does not affect the glass substrate because the temperature of the amorphous membrane is increased by the difference in absorption coefficient between the amorphous membrane and the glass substrate.
    [61] Thereafter, as shown in FIG. 2D, electrodes 15 are installed at both ends of the amorphous silicon thin film 13 and an electric field is applied thereto. When the electric field is applied, the binding energy of the amorphous silicon film is reduced due to the free electrons of the catalytic metal, thereby lowering the crystallization temperature and increasing the crystallization rate.
    [62] For example, the crystallization time of about 10 hours is required at 500 ° C. in the state in which no electric field is applied, but the crystallization time is shortened to within 10 minutes in the state in which the electric field is applied.
    [63] In this case, molybdenum (Mo), graphite, or the like is used as the electrode material, and the intensity of the electric field is about 1 to 1000 V / cm, and the intensity of the electric field changes with time.
    [64] As a result, the amorphous silicon thin film 13 formed on the substrate 11 is crystallized into a polysilicon thin film.
    [65] Here, an embodiment in which a catalyst metal has been incident is crystallized by first irradiating ultraviolet rays and applying an electric field, but an electric field may be applied simultaneously with ultraviolet irradiation, or an ultraviolet ray may be irradiated after applying an electric field.
    [66] Second embodiment
    [67] 3 is a cross-sectional view for explaining a method of crystallizing an amorphous film according to a second embodiment of the present invention.
    [68] As shown in FIG. 3, the second embodiment is characterized in that the catalytic metal is deposited on the bottom of the amorphous silicon thin film.
    [69] Specifically, the crystallization method according to the second embodiment will be described. First, a silicon oxide film (SiO 2) 22 is formed on the substrate 21 as a buffer layer.
    [70] Next, an appropriate amount of a catalyst metal 24 such as nickel is uniformly disposed on the silicon oxide film 22 by using a plasma of a non-reactive gas, and amorphous silicon is deposited on the entire surface including the catalyst metal 24 by plasma CVD. The vapor deposition is performed to form the amorphous silicon thin film 23.
    [71] Here, the catalytic metal 24 is a unit area (㎝ 2) per 5 × 10 12 ~5 × 10 14 degree, and so the deposition, the catalyst metal in order to prevent a leakage current due to the catalytic metal to increase the size of the crystal grains and the residual To control the amount of.
    [72] Subsequently, an annealing process of irradiating ultraviolet rays on the amorphous silicon thin film 23 having the catalyst metal 24 disposed thereon is performed so that the temperature of the substrate reaches 100 to 1200 ° C. At this time, the catalyst metal is diffused into the amorphous silicon thin film without thermally affecting the substrate to form a nickel silicide phase (NiSi 2 ).
    [73] At this time, the wavelength of UV shall be 100-400 nm.
    [74] Next, electrodes 25 are provided at both ends of the amorphous silicon thin film 23 and an electric field having an intensity of about 1 to 1000 V / cm is applied so that crystal grains grow around the silicide.
    [75] In this case, as the material for the electrode, molybdenum (Mo), graphite (Graphite), and the like are used, and the strength of the electric field is changed over time.
    [76] As a result, the amorphous silicon thin film 23 formed on the substrate 21 is crystallized into a polysilicon thin film.
    [77] Here, the annealing step through ultraviolet rays and the electric field may be performed simultaneously or at this time.
    [78] Third embodiment
    [79] 4 is a cross-sectional view illustrating a method of crystallizing an amorphous film according to a third embodiment of the present invention.
    [80] As shown in FIG. 4, the third embodiment is characterized by depositing a catalytic metal in the middle of an amorphous silicon thin film.
    [81] Referring to FIG. 4, the crystallization method according to the third embodiment of the present invention will be described. First, a silicon oxide film (SiO 2 ) 32 is formed on the substrate 31 as a buffer layer. Here, the silicon oxide film 32 is obtained by contacting oxygen or water vapor with a silicon thin film deposited on the substrate 31, followed by chemical reaction.
    [82] Thereafter, amorphous silicon is deposited on the silicon oxide layer 32 by plasma CVD to form a first amorphous silicon thin film 33a, and nickel on the first amorphous silicon thin film 33a using plasma of an unreactive gas. An appropriate amount of catalytic metal 34 such as the above is uniformly arranged.
    [83] At this time, the area in which the catalyst metal 34 is disposed is set to 5 × 10 12 to 5 × 10 14 per unit area (cm 2 ), to increase the size of crystal grains and to prevent leakage current due to the remaining catalyst metal. To control its amount.
    [84] Next, amorphous silicon is deposited on the entire surface including the catalyst metal 34 by plasma CVD to form a second amorphous silicon thin film 33b. That is, the catalyst metal 34 is interposed between the first amorphous silicon thin film 33a and the second amorphous silicon thin film 33b.
    [85] Thereafter, ultraviolet rays having a wavelength of 100 to 400 nm are irradiated from the upper portions of the first and second amorphous silicon thin films 33 interposed with the catalyst metal so that the temperature of the substrate 31 is 100 to 1200 ° C. ) Diffuses from the silicon thin film interface toward the silicon thin film to form a nickel silicide phase.
    [86] At this time, by performing an annealing process by ultraviolet irradiation, the temperature of only the first and second amorphous silicon thin films 33a and 33b can be increased without thermally affecting the substrate 31.
    [87] Next, electrodes 35 are provided at both ends of the amorphous silicon thin film 33 and an electric field having an intensity of about 1 to 1000 V / cm is applied to grow crystal grains around the nickel silicide. In this way, the crystallization temperature and the crystallization time can be reduced by crystallization by applying an electric field.
    [88] In this case, as the material for the electrode, molybdenum (Mo), graphite (Graphite), and the like are used, and the strength of the electric field is changed over time.
    [89] As a result, the first and second amorphous silicon thin films 33a and 33b formed on the substrate 31 are crystallized to form a polycrystalline silicon thin film.
    [90] Here, the annealing step through ultraviolet rays and the electric field may be performed simultaneously or at this time.
    [91] 5 is an optical photomicrograph of a silicon thin film before and after crystallization according to the present invention, Figure 6 is a graph showing the Raman spectrum of the polysilicon thin film according to the present invention.
    [92] First, looking at the optical micrograph of the silicon thin film to which the technical feature of the present invention is applied, it can be seen that the optical transmittance of the crystalline silicon thin film is much crystallized compared to the amorphous silicon thin film before crystallization, as shown in FIG. Here, the optical transmittance indicates the degree of crystallization.
    [93] At this time, the polysilicon is a crystal of 300nm thick amorphous silicon, and then 1.26 × 10 14 cm -2 by injecting a catalytic metal and crystallized at 500 ℃ for 10 minutes while applying an electric field of 30V / cm.
    [94] On the other hand, referring to the Raman spectrum of the polycrystalline silicon produced by the embodiment of the present invention, as shown in Figure 6, a sharp peak due to crystalline silicon appears in the vicinity of 520㎝ -1, the fine crystal grains in the vicinity of 500㎝ -1 Soft broad peaks appear. Here, the absence of a peak due to amorphous silicon around 480 cm −1 is evidence of the absence of non-crystallized amorphous silicon in the thin film, indicating that it is completely crystallized. As a result of calculating the exact value, it showed a volume fraction of 88.34%.
    [95] Hereinafter, the crystallization method of the amorphous film according to the first embodiment will be described by applying to the manufacturing method of the liquid crystal display device.
    [96] 7A to 7F are cross-sectional views illustrating a method of manufacturing a liquid crystal display device according to the present invention.
    [97] First, as shown in FIG. 7A, a silicon film is formed on the first substrate 111 and chemically reacted with oxygen or water vapor at a high temperature of 800 to 1200 ° C. to form a silicon oxide film (SiO 2 ) 112. Amorphous silicon is deposited on plasma 112 by plasma CVD to form an amorphous silicon thin film 113.
    [98] Next, as shown in FIG. 7B, the catalyst metal 114 is disposed on the amorphous silicon thin film 113 by a sputtering process using plasma.
    [99] The catalyst metal 114 uses nickel (Ni), cobalt (Co), or the like, and the amount of metal particles incident on the amorphous silicon thin film 113 is 5 × 10 12 to 5 × 10 14 per unit area (cm 2 ). Arranged as uniformly as possible, it is important to control the amount of the catalyst metal in order to prevent the growth size of the grain and leakage current.
    [100] Next, ultraviolet rays having a wavelength of 100 to 400 nm are irradiated from the upper side of the substrate on which the catalyst metal 114 is disposed so that the temperature of the amorphous silicon thin film 113 reaches 300 to 1200 ° C. so that the catalyst metal diffuses toward the silicon thin film to form a silicide phase. To form (NiSi 2 ). The silicide promotes crystallization and serves to lower the crystallization temperature.
    [101] At this time, by irradiating with ultraviolet rays, the temperature of the amorphous silicon thin film can be raised without applying any thermal deformation to the substrate.
    [102] Thereafter, as shown in FIG. 7C, electrodes 115 are installed at both ends of the amorphous silicon thin film 113 and an electric field having an intensity of about 1 to 1000 V / cm is applied to grow crystal grains around the silicide. . At this time, the strength of the electric field is changed over time.
    [103] As a result, the amorphous silicon thin film 113 formed on the substrate 111 is crystallized into a polysilicon thin film.
    [104] At this time, the step of irradiating ultraviolet rays to the substrate on which the catalytic metal is incident and the step of applying the electric field are performed simultaneously or at this time.
    [105] After the crystallization process, as shown in FIG. 7D, the polysilicon thin film is patterned to form a semiconductor layer 123, and an insulating film such as silicon nitride is laminated on the entire surface including the semiconductor layer 123 by sputtering. A gate insulating film 124 having a thickness is formed.
    [106] Subsequently, a low resistance metal is deposited on the gate insulating layer 124 to about 3000 Å and then patterned by photolithography to form a gate wiring and a gate electrode 125 branching from the gate wiring.
    [107] Subsequently, after implanting n + impurity into the semiconductor layer 123 using the gate electrode 125 as a mask, source / drain regions 123a / 123c and the channel region 123b are formed.
    [108] As shown in FIG. 7E, an insulating film such as silicon nitride having low dielectric constant is deposited on the entire surface including the gate electrode 125 by plasma CVD to form an interlayer insulating film 126, and the interlayer insulating film 126 and the gate are formed. The insulating layer 124 is selectively removed to expose a predetermined portion of the source / drain regions 123a and 123c.
    [109] Subsequently, a low resistance metal is deposited on the interlayer insulating layer 126, and then patterned by photolithography to the data lines 127 crossing the gate lines and the exposed source / drain regions 123a and 123c. Source / drain electrodes 127a / 127b are connected to each other.
    [110] At this time, the semiconductor layer, the gate electrode, and the source / drain electrode made of the polysilicon become a polysilicon thin film transistor and are disposed at the point where the gate line and the data line cross each other.
    [111] Since the amount of the catalyst metal is controlled in the above, the polysilicon thin film transistor has almost no catalyst metal remaining in the channel region, thereby preventing the leakage of current by the catalyst metal.
    [112] Subsequently, as shown in FIG. 7F, an insulating film of BCB, acrylic resin, silicon nitride, or the like is deposited on the entire surface including the source / drain electrodes 127a / 127b to a predetermined thickness to form a protective film 128.
    [113] A transparent conductive film such as ITO is deposited on the passivation layer 128 and then patterned to form a pixel electrode 122 connected to the drain electrode 127b.
    [114] Next, although not shown, a color filter layer composed of R, G, and B (red, green, blue) is formed on the second substrate by using a dyeing method, an electrodeposition method, a pigment dispersion method, a printing method, and the like, on the color filter layer. A common electrode made of ITO is formed.
    [115] Finally, when the first substrate and the second substrate are opposed to each other, the liquid crystal is injected into a space of several μm therebetween, and the liquid crystal injection hole is sealed to complete the liquid crystal display device including the polysilicon.
    [116] The manufacturing method of the liquid crystal display device is not limited to the application of the first embodiment of the crystallization method of the amorphous film, it is possible to apply various embodiments.
    [117] In the above embodiment, the amorphous silicon thin film is crystallized as an amorphous film, but the technical features of the present invention are not limited to the crystallization of the amorphous silicon thin film.
    [118] The manufacturing method of the polysilicon thin film transistor of the present invention as described above and the manufacturing method of the liquid crystal display device using the same have the following effects.
    [119] First, crystallization time can be shortened by crystallizing an amorphous silicon film into a polycrystalline silicon film by irradiating UV while applying an electric field. Therefore, the deformation of the large-area large-area substrate can be minimized, and it is possible to flexibly cope with the enlargement of the substrate.
    [120] Second, since the entire thin film can be uniformly crystallized at a low temperature, a glass substrate can be used, and crystal grains have excellent characteristics.
    [121] Therefore, it is possible to substitute a polycrystalline silicon film required for a thin film transistor liquid crystal display device, a solar cell, an image sensor, etc. in place of the laser polycrystalline silicon film currently used. Furthermore, due to the advantage that it can be produced at low temperature, it is also possible to replace the polycrystalline silicon film by the high temperature solid phase crystallization method.
    权利要求:
    Claims (32)
    [1" claim-type="Currently amended] Forming an amorphous film on which a catalyst metal is deposited;
    Irradiating ultraviolet light to the amorphous film;
    And applying an electric field to the amorphous film.
    [2" claim-type="Currently amended] The method of claim 1, wherein the catalyst metal is formed on the amorphous film.
    [3" claim-type="Currently amended] 2. The method of claim 1, wherein the catalyst metal is formed at the bottom of the amorphous film.
    [4" claim-type="Currently amended] The method of claim 1, wherein the catalyst metal is formed in the amorphous film intermediate layer.
    [5" claim-type="Currently amended] The method of claim 4, wherein the forming of the catalyst metal in the amorphous film intermediate layer,
    Forming a first amorphous film on the substrate;
    Depositing a catalyst metal on the first amorphous film;
    Forming a second amorphous film on the first amorphous film including the catalyst metal.
    [6" claim-type="Currently amended] 2. The method of claim 1, wherein irradiating the ultraviolet light to the amorphous film and applying the electric field are performed simultaneously or at the same time.
    [7" claim-type="Currently amended] The amorphous film crystallization method according to claim 1, wherein the wavelength of the ultraviolet ray is 100 to 400 nm.
    [8" claim-type="Currently amended] The method for crystallizing an amorphous film according to claim 1, wherein the temperature of the amorphous film reaches 300 to 1200 ° C during the ultraviolet irradiation.
    [9" claim-type="Currently amended] The method of claim 1, wherein the electric field is changed over time.
    [10" claim-type="Currently amended] 2. The method of claim 1, wherein the strength of the electric field is 1 to 1000 V / cm.
    [11" claim-type="Currently amended] 2. The method of claim 1, wherein the catalyst metal is nickel.
    [12" claim-type="Currently amended] 2. The method of claim 1, wherein the catalytic metal is deposited using plasma.
    [13" claim-type="Currently amended] The method of claim 1, wherein the catalyst metal is deposited by 5 × 10 12 to 5 × 10 14 per unit area (cm 2 ).
    [14" claim-type="Currently amended] 2. The method of claim 1, wherein the amorphous film is made of amorphous silicon.
    [15" claim-type="Currently amended] The method of claim 1, wherein a buffer layer is further formed on the substrate before the amorphous film is formed.
    [16" claim-type="Currently amended] Forming an amorphous film on which a catalytic metal is deposited on a first substrate;
    Irradiating ultraviolet light on the amorphous film and applying an electric field to crystallize the polycrystalline film;
    Patterning the polycrystalline film to form a semiconductor layer;
    Forming a gate electrode insulated from the semiconductor layer at a predetermined portion of the semiconductor layer;
    Implanting impurities into the semiconductor layer to form a channel region and a source / drain region;
    Forming a source / drain electrode connected to the source / drain region;
    Forming a pixel electrode connected to the drain electrode;
    And forming a liquid crystal layer between the second substrates opposite to the first substrate.
    [17" claim-type="Currently amended] The method of claim 16, wherein the catalyst metal is deposited on the amorphous film, on the bottom of the amorphous film, or deposited on an intermediate layer of the amorphous film.
    [18" claim-type="Currently amended] 18. The method of claim 17, wherein the forming of the catalyst metal in the amorphous film intermediate layer,
    Forming a first amorphous film on the substrate;
    Depositing a catalyst metal on the first amorphous film;
    And forming a second amorphous film on the first amorphous film.
    [19" claim-type="Currently amended] 17. The method of claim 16, wherein the irradiating the ultraviolet light to the amorphous film and applying the electric field are performed simultaneously or at the same time.
    [20" claim-type="Currently amended] The method of manufacturing a liquid crystal display device according to claim 16, wherein the wavelength of the ultraviolet ray is 100 to 400 nm.
    [21" claim-type="Currently amended] 17. The method of manufacturing a liquid crystal display device according to claim 16, wherein ultraviolet rays are irradiated so that the temperature of the amorphous film reaches 300 to 1200 占 폚.
    [22" claim-type="Currently amended] 17. The method of claim 16, wherein the electric field changes with time.
    [23" claim-type="Currently amended] 17. The method of claim 16, wherein the intensity of the electric field is 1 to 1000 V / cm.
    [24" claim-type="Currently amended] 17. The method of claim 16, wherein the catalyst metal is nickel.
    [25" claim-type="Currently amended] The method of claim 16, wherein the catalyst metal is deposited by 5 × 10 12 to 5 × 10 14 per unit area (cm 2 ).
    [26" claim-type="Currently amended] 17. The method of claim 16, further comprising: forming a gate wiring simultaneously with the gate electrode;
    And forming a data line crossing the gate line at the same time as the source / drain electrode.
    [27" claim-type="Currently amended] The method of claim 16, further comprising forming an insulating film on the entire surface including the gate electrode after the gate electrode is formed.
    [28" claim-type="Currently amended] 28. The method of claim 27, wherein the insulating film is formed of silicon nitride or silicon oxide.
    [29" claim-type="Currently amended] 17. The method of claim 16, further comprising forming a protective film exposing a predetermined portion of the drain electrode after the source / drain electrode is formed.
    [30" claim-type="Currently amended] 30. The method of claim 29, wherein the protective film is formed of silicon nitride, silicon oxide, BCB, or acrylic resin.
    [31" claim-type="Currently amended] 17. The method of manufacturing a liquid crystal display device according to claim 16, wherein the amorphous film is made of amorphous silicon.
    [32" claim-type="Currently amended] 17. The method of claim 16, wherein a buffer layer is further formed on the substrate before the amorphous film is formed.
    类似技术:
    公开号 | 公开日 | 专利标题
    JP5656335B2|2015-01-21|Semiconductor device
    US8389345B2|2013-03-05|Thin film transistor and manufacturing method of the same
    US7511300B2|2009-03-31|Array substrate, display device having the same and method of manufacturing the same
    US6130455A|2000-10-10|Semiconductor device, thin film transistor having an active crystal layer formed by a line containing a catalyst element
    US6346718B1|2002-02-12|Electro-optic device, drive substrate for electro-optic device and method of manufacturing the same
    KR100227439B1|1999-11-01|Polycrystalline thin film and the manufacturing method of thin film semiconductor device
    KR100273831B1|2001-01-15|Method for manufacturing semiconductor device
    US5677240A|1997-10-14|Method for forming a semiconductor device
    TWI234288B|2005-06-11|Method for fabricating a thin film transistor and related circuits
    KR100561991B1|2006-05-25|Method for making thin film transistor
    KR100375289B1|2003-08-02|Semiconductor devices and display devices and their manufacturing methods
    US6613613B2|2003-09-02|Thin film type monolithic semiconductor device
    JP4026182B2|2007-12-26|Semiconductor device manufacturing method and electronic device manufacturing method
    US5466617A|1995-11-14|Manufacturing electronic devices comprising TFTs and MIMs
    TW577174B|2004-02-21|Method and apparatus for forming a thin semiconductor film, method and apparatus for producing a semiconductor device, and electro-optical apparatus
    US6677221B2|2004-01-13|Semiconductor device and the fabricating method therefor
    JP3306258B2|2002-07-24|Method for manufacturing semiconductor device
    US6500736B2|2002-12-31|Crystallization method of amorphous silicon
    US5942768A|1999-08-24|Semiconductor device having improved crystal orientation
    US6323528B1|2001-11-27|Semiconductor device
    KR100470274B1|2005-02-05|Method of phase transition of amorphous material using a cap layer
    JP2762215B2|1998-06-04|Method for manufacturing thin film transistor and semiconductor device
    US5808315A|1998-09-15|Thin film transistor having transparent conductive film
    US6825070B2|2004-11-30|Electro-optical apparatus, driving substrate for an electro-optical apparatus and method of manufacturing them
    KR100191091B1|1999-07-01|Thin film transistor and its fabrication method
    同族专利:
    公开号 | 公开日
    KR100662492B1|2007-01-02|
    US20030013237A1|2003-01-16|
    US7074728B2|2006-07-11|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    2001-07-10|Application filed by 엘지.필립스 엘시디 주식회사, 학교법인 경희대학교
    2001-07-10|Priority to KR1020010041377A
    2003-01-23|Publication of KR20030005909A
    2007-01-02|Application granted
    2007-01-02|Publication of KR100662492B1
    优先权:
    申请号 | 申请日 | 专利标题
    KR1020010041377A|KR100662492B1|2001-07-10|2001-07-10|Crystallizatiion Method And Method For Fabricating Liquid Crystal Display Device By Using Said Method|
    [返回顶部]